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Global Die Attach Materials market is valued at 770 million US$ in 2018 is expected to reach 1200 million US$ by the end of 2025, growing at a CAGR of 5.7% during 2019-2025

Global Die Attach Materials Market Research Report 2019

Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.
For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results.

In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share.

At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016.

In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and . Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global.

In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.

The global Die Attach Materials market is valued at 770 million US$ in 2018 is expected to reach 1200 million US$ by the end of 2025, growing at a CAGR of 5.7% during 2019-2025.
This report focuses on Die Attach Materials volume and value at global level, regional level and company level. From a global perspective, this report represents overall Die Attach Materials market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The report includes an in-depth analysis of the competitive landscape of this business vertical, constituting manufacturers like:
SMIC
Henkel
Shenzhen Vital New Material
Indium
Alpha Assembly Solutions
TONGFANG TECH
Umicore
Heraeu
AIM
TAMURA RADIO
Kyocera
Shanghai Jinji
Palomar Technologies
Nordson EFD
Dow Corning Corporation

Market Segment by Regions includes:
North America
Europe
China
Japan

Products Segmentation, this report displays the production, revenue, price, market share, and growth rate of each type as below:
Die Attach Paste
Die Attach Wire

By Industrial Application, the market can be split into:
Consumer Electronics
Automotive
Medical
Telecommunications

Market Segment by Regions includes:

  • North America (the USA, Canada, and Mexico)
  • Europe (Germany, France, UK, Russia, and Italy)
  • Asia-Pacific (China, Japan, Korea, India, and Southeast Asia)
  • South America
  • Middle East and Africa.

Browse contents of Global Die Attach Materials Market Research Report 2019

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Joseph Anthony Jones
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